The Taiwan Semiconduction Manufacturing Company (TSMC) is upgrading its technologies to a 3nm chip node. Two variants, N3E and N3B are expected to be on the production lines soon. Apple, Qualcomm, and Intel are reported to be on the customer base for the N3E variant. This N3E is expected to be introduced after the N3B node.
The semiconductor giant has mentioned on its official website that, “TSMC’s 3nm technology (N3) will be another full node stride from our 5nm technology (N5), and offer the most advanced foundry technology in both PPA and transistor technology when it is introduced.
N3 technology will offer up to 70% logic density gain, up to 15% speed improvement at the same power, and up to 30% power reduction at the same speed as compared with N5 technology. N3 technology development is on track with good progress. N3 technology will offer complete platform support for both mobile and HPC applications, which is expected to receive multiple customer product tape-outs in 2021. In addition, volume production is targeted in the second half of 2022”.
The company reported that improving the 3nm process helped them to improve the 2nm technology despite the bottleneck in production. Taiwanese publication Digitimes stated that the 3nm production will range from 40,000 and 50,000 wafers per month.
Another popular media, the UDN reported that the Nanke plant will manufacture 15,000 3nm wafers per month whereas the Hsinchu plant will give an output of between 10,000 to 20,000 wafers per month. It also added that the N3E production might reach 50,000 wafers per month next year with an initial capacity of 25,000 wafers per month.
Earlier the Hsinchu facility was only responsible for research and development and for the first time the TSMC converted the facility into a production line. The facility is reported to manufacture chips for Intel Corporation. The company will also accelerate the production next year.